The new X-Series improves on the design of the existing phone   plug by offering the thinnest available 1/4" plug with unique Neutrik chuck type   strain relief on the market. The new plugs meet the most recent requirements for   highest packing density, which is 15.88mm jack pitch.
      
TECHNICAL DATA 

          

        Electrical 

        Rated current:   depends on mating connector

        Contact resistance: depends on mating   connector

        Insulation resistance - initial: > 2 G Ohm

        - after damp heat   test: = 1 G Ohm

        Dielectric strength: 1 kV dc

        

        Mechanical 

        Wiring:   solder terminals

        Wire size: 1 mm / AWG 18

        Cable O.D.: 4 - 7   mm

        Solderability: complies with IEC 68-2-20

        

        Materials 

        Shell   ZnAl4Cu1, Ni or black Cr plated

        Insulation: PA 6.6 30% GR

        Contacts:   CuZn39Pb3, 2  Ni (Su) or gold plated

        Chuck: POM

        Bushing: Polyamid   PA6

    Temperature range: -20 ℃ to +65 ℃